A fungus found on dead hardwood trees could be key to reducing the amount of plastic required in modern electronics.
Aerospace and defense giant Northrop Grumman recently detailed work by researchers at an Austrian university to develop a mushroom-based material that could serve as a base for computer chips.
Mushroom skin breaks down much faster than plastic, but it also features high conductivity for electricity. However, previous attempts to utilize mushrooms for chip components reportedly turned out “bulky and ineffective.” Scientists at Johannes Kepler University in Linz, Austria, focused on Ganoderma lucidum, a fungus found in temperate climates. The team grew the mushroom skin using beech wood savings and a polyethylene separator, then peeled, dried, and compressed the material.
The resulting product could withstand temperatures as high as 480 degrees Fahrenheit across three different phases, making them suitable for soldering and other processes. Researchers successfully deposited thin gold and copper layers on the skin, ultimately crafting batteries, humidity and proximity seasons, and a Bluetooth communication device.
The material also broke down in mere days in a standard compost bin, and Ganoderma lucidum and other fungi can be easily grown almost anywhere. If the study can be developed and scaled across the broader consumer electronics sector, it could help alleviate a spike in electronic waste due to discarded smartphones, laptops, and other devices.
